“Spending for new semiconductor equipment is down considerably as anticipated. Overall 2008 spending will approach 2005 levels, with a recovery expected for next year,” noted Dan Tracy, senior director of industry research and statistics at SEMI.

By Ann Steffora Mutschler, Senior Editor — Electronic News, 9/10/2008

Semiconductor Equipment and Materials International (SEMI) reported late Tuesday that Q2 worldwide billings of semiconductor manufacturing equipment reached $7.83 billion, representing a 26% sequential drop from Q1, and was 29% less than Q2 2007.

In terms of Q2 worldwide bookings of semiconductor equipment, that figure dropped to $6.99 billion, down 30% from Q2 2007 and 13% less than Q1 bookings.

“Spending for new semiconductor equipment is down considerably as anticipated. Overall 2008 spending will approach 2005 levels, with a recovery expected for next year,” noted Dan Tracy, senior director of industry research and statistics at SEMI, in a statement.

Quarterly Billings Data by Region (in millions of U.S. dollars) on Year-over-Year and Quarter-over-Quarter Growth Rates by Region

Region

2Q 2008

1Q 2008

2Q 2007

2Q08/1Q08
(Q-o-Q)

2Q08/2Q07
(Y-o-Y)

Europe

0.52

0.73

0.62

-29%

-15%

China

0.47

0.81

1.22

-42%

-61%

Japan

1.93

2.39

2.06

-19%

-6%

North America

1.25

1.84

1.51

-32%

-17%

Korea

1.41

1.74

1.77

-19%

-20%

Taiwan

1.45

2.37

3.20

-39%

-55%

ROW

0.80

0.67

0.63

19%

26%

Total

7.83

10.56

11.01

-26%

-29%

Source: SEMI/SEAJ September 2008
Note: Figures may not add due to rounding.

The data is gathered in cooperation with the Semiconductor Equipment Association of Japan (SEAJ) from more than 150 global equipment companies that provide data on a monthly basis.

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